Microvias: For Low Cost, High Density Interconnects (Electronic Packaging and Interconnection)
| Author | : | |
| Rating | : | 4.74 (759 Votes) |
| Asin | : | B00LUAFO96 |
| Format Type | : | |
| Number of Pages | : | 253 Pages |
| Publish Date | : | 2017-03-09 |
| Language | : | English |
DESCRIPTION:
Lee (Hong Kong, China) is a Professor of Electrical Engineering at the University of Hong Kong. Lau (Palo Alto, CA) is the President of Express Packaging Systems, Inc. . He is the author of nine previous technical books and teaches throughout the world. John H. Ricky S
K.L. Jim said Useful overview of topics. This book gives an excellent review of microvias and WLCSP technologies, with real-world examples from the electronic packaging industry. It focuses largely on how to create effective & reliable low-cost, high density interconnects in modern high speed system designs. It provides a sufficient amount of theory so that the the reader can understand the fundamental issues assosiated with high density interconnection. It's a comprehensive book with the ability to keep you satisfied no matter what you are looking for.. Useful overview of topics This book gives an excellent review of microvias and WLCSP technologies, with real-world examples from the electronic packaging industry. It focuses largely on how to create effective & reliable low-cost, high density interconnects in modern high speed system designs. It provides a sufficient amount of theory so that the the reader can understand the fundamental issues assosiated with high density interconnection. It's a comprehensive book with the ability to keep you satisfied no matter what you are looking for.
A "must" for electronics and mechanical engineers, John Lau and Ricky Lee’s intensive introduction to microvia technology expertly covers all major techniques. You also get a survey of the work of leading companies and their products, including Canon, Compaq, Fujitsu Limited, Gore, Hitachi Chemical Co., Ibiden, IBM, JCI, JVC, K&S (X-Lam), Kyocera/JME, Matsushita, Mitsubishi, NEC, Samsung, Sheldahl, Shinko, Toshiba.. State-of-the-art introduction to high-density interconnect technology The first-ever book on this hot topic, Microvias: Low Cost, High Density Interconnects gives you a thorough look at the technology that’s changing the nature of printed circuit boards--and driving the mobile electronic revolution. You get important details on mechanical NC drilling, laser drilling, photo-defined, chemical and plasma etching, and conductive ink formation
This one-stop guide meets the reference needs of design, materials, process, equipment, manufacturing, reliability, component, packaging, marketing, and system engineers, and technical managers working in electronic packaging and interconnection. Page after page, this standard-setting guide gives you both essential technical details and an eye-opening overview of this fast-developing field. . This reference gives you cutting edge information on the most important developments and latest research results in applying the microvia and WLCSP technologies to low-cost and high-density interconnects. With this book you will develop a practical understanding of the cost, design, materials, process, equipment, manufacturing, and reliability issues of microvia and WLCSP technologies. Among the topics explored: * *IC trends and their packaging technology updates *Design, materials, imaging, drilling, plating, etching, solder resist, machining, and